Circuits Assembly Online Magazine - SIA Lowers Semi Forecast: Sales Will Grow by Only 1.8% in 2007

NEWS

Electronics Unit Drags Down Lacroix's 2024 Sales

SAINT-HERBLAIN, FRANCE -- Lacroix reported 2024 revenue of €635.5 million ($686 million), an 8.6% year-over-year decline from 2024 on a like... Read More...

K&S to Dissolve Electronics Assembly Equipment Unit

SINGAPORE -- Kulicke Soffa will wind down its electronics assembly equipment business and take charges of up to $100 million as part of a ... Read More...

ADAC Automotive Acquires EBW Electronics

GRAND RAPIDS, MI -- ADAC Automotive today announced the acquisition of EBW Electronics, an electronics design and assembly company. Read More...

EMS Shipments Rise Again in February

BANNOCKBURN, IL — The 90-day moving average shipments by North American electronics manufacturing services companies rose 1.7% in year-over-... Read More...

N. American Bare Board B2B Hits High Mark, IPC Says

BANNOCKBURN, IL — The 90-day moving average shipments among North American printed circuit board fabricators rose 11.3% in February from a y... Read More...

Semi Fab Equipment Investment Expected to Reach $110B in 2025; Ajit Manocha Comment

MILPITAS, CA - Global fab equipment spending for front-end facilities in 2025 is anticipated to increase by 2% year-over-year to $110 billio... Read More...

AR/VR Shipments See Bumpy Forecast, According to IDC; Jitesh Ubrani and Ramon T. Llamas Comment

NEEDHAM, MA – Global shipments for AR/VR headsets grew 10% in 2024, according to new data from IDC. The launch of new products during the ho... Read More...

NAND Flash Prices to Recover in Q2 as Production Cuts and Inventory Rebuilding Take Effect, Says TrendForce

TAIPEI – NAND flash prices are expected to stabilize in the second quarter, while prices for wafers and client SSDs are projected to rise, t... Read More...

VS Industry Net Profit Drops 4% in 2Q Amid Less Favorable Forex

KUALA LUMPUR - VS Industry Bhd’s net profit fell nearly 4% to RM15.38 million ($225,000) for its second quarter ended Jan 31, from RM16 mill... Read More...

FEATURES

The Benefits of Nitrogen in PCB Soldering

Introducing nitrogen to the solder process can enhance reliability and yields. Inert gas soldering systems, which use a controlled nitrogen blanket atmosphere ... Read More...

Is the Industry Ready for a Solderless World?

The time is now for serial inventor Joe Fjelstad’s answer to simplifying component assembly. Joe Fjelstad is a renowned innovator, environmental advocate and t... Read More...

Understanding Solder Paste Viscosity and Thixotropy

Selecting the right paste requires an understanding of its properties. A solder paste’s viscosity and thixotropic properties influence its performance in diffe... Read More...

How Squeegee Blade Profile Helps Improve the Screen-Printing Process

A factorial design investigating solder paste volume under varied squeegee pressure and squeegee types. It is generally agreed that, on average, 40% to 60% of ... Read More...

‘It’s Got to Work’

STI Electronics prides itself on reliability and training the next generation of workers. With its home just a few miles from a major military and aerospace te... Read More...

Comparing Coated vs. Uncoated Stencils

While cheaper to use, uncoated stencils can have a detrimental effect on printing performance. In a recent study focused on optimizing solder paste transfer ef... Read More...

Ensuring Optimal Performance of Solder Paste in Challenging Environments

Heat and cold can prematurely degrade incorrectly handled materials. Solder paste is an elaborate mixture of metal powders, acids, thixotropes, solvents and a ... Read More...

Filling the Gap: Underfill Materials Dispensing for Electronics

The benefits of capillary flow underfills on solder joint reliability. In electronics manufacturing, underfill refers to a material that is applied to fill the... Read More...

Keeping Electronics Cool

Types of TIMs and their application methods. As demand for high-performance electronic devices continues to grow, managing heat dissipation effectively has bec... Read More...